BASF (Ludwigshafen, Germany) has already built somewhat of a reputation in developing low-warpage injection molding grades based on a blend of polybutylene terephthalate (PBT) and ...
Warpage is becoming a serious concern in advanced packaging, where a heterogeneous mix of materials can cause uneven stress points during assembly and packaging, and under real workloads in the field.
Delo is proposing low-viscosity UV-curable moulding compounds for FOWLP – fan-out wafer-level packaging. “With the use of UV-curable molding materials instead of heat curing ones, warpage and die ...
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