In industry, the detection of anomalies such as scratches, dents, and discolorations is crucial to ensure product quality and safety. However, conventional methods rely on heavy computational ...

At-speed testing and delay defect analysis have become increasingly critical in ensuring the reliability and performance of modern integrated circuits. As circuit complexity grows alongside rapid ...

Figure 1. Enertis Applus+ technicians performing terrestrial nighttime EL inspection on a PV plant (left), while an aerial night-time EL inspection is being conducted using a drone (right). Image: ...

Electron-beam inspection is proving to be indispensable for finding critical defects at sub-5nm dimensions. The challenge now is how to speed up the process to make it economically palatable to fabs.

Advanced packaging is transforming semiconductor manufacturing into a multi-dimensional challenge, blending 2D front-end wafer fabrication with 2.5D/3D assemblies, high-frequency device ...

Researchers have designed a robust image-based anomaly detection (AD) framework with illumination enhancement and noise suppression features that can enhance the detection of subtle defects in ...