Semiconductor Engineering sat down to discuss lithography and photomask technologies with Gregory McIntyre, director of the Advanced Patterning Department at Imec; Harry Levinson, senior fellow and ...

Layout decomposition represents a critical step in the semiconductor manufacturing process, whereby integrated circuit designs are partitioned into multiple layers or masks to overcome the inherent ...

Si2 announced that Cadence has donated extensions to the OpenAccess community which enable physical design tools to represent Multi-Patterned Technology (MPT). Conventional photolithography cannot ...

TOKYO--(BUSINESS WIRE)--Nikon Corporation has announced release of the NSR-S622D ArF immersion scanner to deliver world-class overlay and ultra-high productivity for the most demanding multiple ...

2019 marked an important milestone for extreme ultraviolet (EUV) lithography. In that year, the EUV patterning technology was for the first time deployed for the mass production of logic chips of the ...

Amid ongoing delays and setbacks, extreme ultraviolet (EUV) lithography and multi-beam e-beam have both missed the 10nm logic node. So for the present, chipmakers must take the brute force route at ...

New dry resist technology being developed with ASML and imec will help to extend EUV lithography’s resolution, productivity and yield FREMONT, Calif., Feb. 26, 2020 (GLOBE NEWSWIRE) -- Lam Research ...

TSMC is planning to adopt double patterning extensively at 20nm, despite the high cost of doing so. Why? Because EUV hasn't come through. Share on Facebook (opens in a new window) Share on X (opens in ...

During a visit by President Barack Obama in February, Intel executives announced plans to build a new semiconductor facility in Chandler, Ariz. To cost more than $5 billion, the plant will be the most ...

Continued demand for mature- and mid-node production: Many analog, power, sensor and packaging layers continue to be manufactured using DUV (28–65 nm and larger), maintaining persistent equipment ...