The global electronics industry continues to rely heavily on China’s advanced PCB manufacturing capabilities. As electronic devices become increasingly sophisticated, the demand for high-quality ...
The TPCM/TPCF Series four-row power-to-board interconnects are suitable for elevated board stacking. With a 2-mm pitch, the connectors handle up to 27 A at 80°C over four banks that each have four ...
TOKYO, JAPAN – Meiko Electronics has raised its fiscal 2025 consolidated earnings forecast, citing sustained demand for high-density interconnect (HDI) printed circuit boards and favorable currency ...
Improving density in circuit design is an ongoing challenge. One solution is to reconsider circuit layouts from the perspective of bandwidth optimization.
The global electronics manufacturing industry is undergoing rapid transformation. The increasing complexity of devices, shrinking component sizes, and the rise ...
Manufacturing challenges below 8mil. When drill to trace spacing falls below 8 mil, the PCB moves into a far more complex manufacturing zone. Standard mechanical drilling is often insufficient, and ...
ERNI has developed a compact and economical wire-to-board interconnect solution with high current density in a small, 2.0 mm pitch form factor. The iBridgeT single-row cable connector system delivers ...
In vibration-critical applications, understanding how a PCB deforms under excitation is essential. Using massively parallel ...
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